Method and apparatus for removing die from an expanded wafer and

Details Method and apparatus for removing die from an expanded wafer and Method and apparatus for removing die from an expanded wafer and

1998-02-18

1999-11-02

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 294263, 294266, 438464, B32B 3500

Patent

active

059763060

ABSTRACT:
A direct die feeder picks known good die from an expanded wafer and places them on a conveyor belt, which conveys the die to a pickup location. Frame (111) supports an expanded wafer (105) which is a wafer that is sawed and adhered onto a flexible film, which is then stretched and mounted in a ring (110). A fork member (125), on which a pick head (150) is mounted slides along an x-axis and frame (111) slides along a vertical axis to allow the pick head (150) to access any die from the expanded wafer. A camera (160) is directed downward at a 45.degree. mirror adjacent to the pick head to capture images of the wafer and determine the precise locations of known good die on the wafer. The pick head (150) can pick die from the wafer and place them directly on the conveyor belt (170) in the conventional orientation, or pass the die to a transfer head (155) which then shifts to the left and lowers the die down past the pick head, placing the die on the conveyor belt in the flipped orientation. The conveyor belt operates until a die is detected at a pickup location (173) at one end of the conveyor except during placing operations of the pick head or transfer head.

REFERENCES:
patent: 4437232 (1984-03-01), Araki et al.
patent: 4876791 (1989-10-01), Michaud et al.
patent: 5671530 (1997-09-01), Combs et al.
Newsome, Robert, "Meeting the Increasing Demands of Assembling Advanced Packages," Electronic Packaging & Production, Jan., 1998; pp. 38-44.
Mullens, Brian, "Chip-On Board Assembly Methods," Electronic Packaging & Production, Apr. 1997; pp. 47-50.

Affiliated with

Also associated with

Rating

Method and apparatus for removing die from an expanded wafer and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for removing die from an expanded wafer and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for removing die from an expanded wafer and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2129897