Method and apparatus for removing dice from a severed wafer

Details Method and apparatus for removing dice from a severed wafer Method and apparatus for removing dice from a severed wafer

1979-12-19

1981-08-25

Rolla, Joseph J.

Classifying, separating, and assorting solids

Sorting special items, and certain methods and apparatus for...

Condition responsive means controls separating means

209606, 209643, B07C 534

Patent

active

042854334

ABSTRACT:
Removing dice (16) from a wafer (10) which has been attached to a tape layer (12, 14) and severed into individual die (16) leaving the tape layer (12, 14) in one piece is accomplished by attaching the tape layer (12, 14) to a length of adhesive tape (18). The adhesive tape (18) is passed across a surface (20) and through a slot (38) in the surface (20) causing the die (16) to pass across the slot (38) and away from the tape layer (12, 14) which remains attached to the adhesive tape (18).

REFERENCES:
patent: 2970730 (1961-02-01), Schwartz
patent: 3031075 (1962-04-01), Luhn et al.
patent: 3165230 (1965-01-01), Hahn
patent: 3497948 (1970-03-01), Weisler et al.
patent: 4046613 (1977-09-01), Kucheck et al.
patent: 4138304 (1979-02-01), Gantley

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