Method and apparatus for removing contaminants from solder

Details Method and apparatus for removing contaminants from solder Method and apparatus for removing contaminants from solder

1993-12-27

1995-02-14

Rowan, Kurt

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 562, 75407, 266229, C22B 902, B23K 306

Patent

active

053887565

ABSTRACT:
A method and apparatus allow for continuous removal of contaminants from solder. The solder is pumped from a main solder pot to an auxiliary solder pot through a skimmer valve which is heated to keep the solder molten. In the auxiliary pot, the solder is cooled so that dissolved contaminants such as copper precipitate out and are removed from the pot. The purified solder is then returned to the main pot, for example, by a gravity feed.

REFERENCES:
patent: 4892653 (1990-01-01), Latge
patent: 5110036 (1992-05-01), Parker, Jr.
patent: 5176742 (1993-01-01), Zabala et al.
Abstract of JA 1-168826 (Jul. 1989), Derwent Publications Ltd., London, England, 1989.

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