Method and apparatus for removing bonded connections

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29827, 294261, 294265, 29762, 228269, H05K 300

Patent

active

052168034

ABSTRACT:
Removing welded outer lead bonds of TAB tape leads to contacts on a substrate. The method includes separating the electrical leads adjacent the weld bonds leaving a remnant, engaging the remnant with a shear tool, and moving the tool and bond relative to each other shearing the remnant. In some cases the tool is ultrasonically vibrated in a direction transversely to the relative movement of the tool and bond.

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IBM Tech Discl Bull vol. 19, No. 7 Dec. 1976 p. 2477 by Angelone.
Western Electric Tech DIG. No. 15 Jul. 1969, pp. 27-28 by J. E. Clark et al.

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