Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-08-19
1995-06-13
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156344, 156584, 2940203, 29762, B32B 3500
Patent
active
054239311
ABSTRACT:
In a method of removing a component from a wiring board to which the component is attached by heat-softenable resin, the improvement is provided of, after softening of the resin by heat and removal of the component, removing residual resin remaining on the board at the location of the component by application of ultraviolet laser radiation having an intensity sufficient to decompose and disperse said residual resin. This can be done without damaging the wiring on the board so that the wiring is re-usable to attach a further electronic component at the same location. Excessive heating of the board can be avoided by measures such as applying a pre-load to the component during softening so that it moves when sufficiently softened, and monitoring the softening.
REFERENCES:
patent: 4954453 (1990-09-01), Venutolo
patent: 5157255 (1992-10-01), Kornrumpf et al.
patent: 5269868 (1993-12-01), Gofuku et al.
Research Disclosure 20 Sep. 1990, Emsworth, GB pate 831 anonymous "Rework of Chips on Flexible Circuit Boards" abstr. nr. 31, 8047.
Hosokawa Takashi
Inoue Hirokazu
Sawahata Mamoru
Takasaka Masahiro
Watanabe Koichi
Hitachi , Ltd.
Osele Mark A.
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