Method and apparatus for removal of semiconductor chips from hyb

Details Method and apparatus for removal of semiconductor chips from hyb Method and apparatus for removal of semiconductor chips from hyb

1975-08-15

1976-07-20

Whitby, Edward G.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29427, 156344, B32B 3500

Patent

active

039698130

ABSTRACT:
A method and apparatus are disclosed for removal of defective semiconductor chips from hybrid integrated circuits. The apparatus includes a jet nozzle which directs at least four high pressure water jet streams to the area surrounding the defective chip. The nozzle is also provided with a fixture for sealing off this area from the rest of the circuit by making contact to the encapsulant on the circuit. The jet streams bore through the encapsulant within the area defined by the fixture and are deflected by the ceramic substrate to an area under the chip thereby lifting off the chip. The invention therefore provides relatively fast removal of the defective chips without damaging the ceramic substrates or other components of the circuit.

REFERENCES:
patent: 3913217 (1975-10-01), Misawa et al.
patent: 3915784 (1975-10-01), Makhijani et al.

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