Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1987-10-13
1989-01-24
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, 439912, H01R 2372
Patent
active
047998920
ABSTRACT:
A method for removably securing the leads of a semiconductor package to the conductive pathways on a circuit board is disclosed. Specifically, a retaining member is provided which includes a plurality of bores each sized to receive a pressure pin. Each pin communicates with a biasing system, enabling the resilient movement of each pin independently of the other pins. The retaining member and pins are positioned above the semiconductor package on the circuit board, and subsequently urged downward so that each pin contacts one of the leads on the package. As a result, the proper pressure is applied to each pin so that it effectively communicates with its designated conductive pathway on the circuit board.
REFERENCES:
patent: 3874768 (1975-04-01), Cutchaw
patent: 3968433 (1976-07-01), Dobarganes
patent: 4397519 (1983-08-01), Cooney
patent: 4463310 (1984-07-01), Whitley
Electronics, 10-9-1980, p. 44.
IBM Bulletin, Spencer, vol. 13, No. 5, p. 1235, 10-1970.
Abrams Neil
Bucher William K.
Lovell William S.
Malkin Jay K.
Triquint Semiconductor, Inc.
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