Method and apparatus for regenerating an etch solution

Etching a substrate: processes – Nongaseous phase etching of substrate – Recycling – regenerating – or rejunevating etchant

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

216102, B44C 122

Patent

active

059807717

ABSTRACT:
A method and apparatus for economically regenerating chemical etch solutions for aluminum and the alloys thereof without the use of large, complex and expensive processing apparatus. The method of the invention can be accomplished substantially at ambient temperature thereby avoiding the necessity for substantial investment in complex temperature control instrumentation. In accordance with the method of the invention, the spent etchant which is to be regenerated is first mixed with water in a separate storage tank and is then cold filtered prior to being transferred to the reactor or regeneration vessel. This step substantially reduces contamination buildup within the reactor vessel and thereby avoids costly periodic shut down of operations for clean-up. Due to the unique nature of the regeneration process of the invention, the alumina produced as a by product of the process is of extremely high quality and is snow white in color.

REFERENCES:
patent: 2975041 (1961-03-01), Holman
patent: 4372805 (1983-02-01), Takahashi et al.
patent: 4960511 (1990-10-01), Dofle et al.
patent: 5049233 (1991-09-01), Davis
patent: 5091046 (1992-02-01), Hunter et al.
patent: 5227010 (1993-07-01), Lubert et al.
patent: 5275691 (1994-01-01), Fukuta et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for regenerating an etch solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for regenerating an etch solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for regenerating an etch solution will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1451038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.