Method and apparatus for refractory metal deposition

Details Method and apparatus for refractory metal deposition Method and apparatus for refractory metal deposition

1988-03-09

1990-09-18

Silverman, Stanley

Coating processes

Electrical product produced

Welding electrode

427140, 427253, B05D 306

Patent

active

049577751

ABSTRACT:
A laser induced direct writing pyrolysis of a refractory metal or metal silicide on substrates is described. Typical reactants comprise flowing WF.sub.6, MoF.sub.6 or TiCl.sub.4 with SiH.sub.4 and an inert gas, such as Argon. A preferable substrate surface is a polyimide film. The refractory metal film may comprise low resistivity W, M, or Ti, or silicides thereof, having a predetermined resistance depending on the relative ratio of reactants. The invention is useful, inter alia, for repair of defective circuit interconnects, and formation of interconnects or resistors on substrates.

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Lo et al., "A CVD Study of the Tungsten Silicon System", Chemical Vapor Deposition, 4th inten. cont.

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