Method and apparatus for reflowing solder stripes on articles

Details Method and apparatus for reflowing solder stripes on articles Method and apparatus for reflowing solder stripes on articles

1983-06-02

1985-03-12

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228200, 228 46, 228 47, 219243, 219 85R, 156311, 432226, B23K 3102, B23K 100

Patent

active

045040087

ABSTRACT:
A conveyor 21 rapidly advances a series of workholders to move printed circuit board connectors 10 mounted therein along a short insulating rail section 37 and a second long cooled rail 31. Presoldered leads 13 overlaying contacts pads 14 are heated to temperatures slightly above the melting point of solder during movement along the first rail 28 and are cooled to solidify the solder during movement along the second rail. A belt 44, moving at the same speed as the conveyor, presses the boards to ensure good contact of the leads with the pads during the melting and cooling of the solder.

REFERENCES:
patent: 3166462 (1965-01-01), Schoder
patent: 3698619 (1972-10-01), Jacquot et al.
patent: 3941292 (1976-03-01), Osipov et al.
patent: 4306674 (1981-12-01), Charles et al.

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