Method and apparatus for reflow-soldering of printed circuit boa

Details Method and apparatus for reflow-soldering of printed circuit boa Method and apparatus for reflow-soldering of printed circuit boa

1991-07-24

1993-01-19

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 62, 228232, 392408, 392416, 392417, B23K 119, B23K 3102

Patent

active

051800969

ABSTRACT:
A method and apparatus for reflow-soldering of printed circuit boards are disclosed. A printed circuit board having electronic parts with lead wires having low temperature resistance alone or together with electronic part of high temperature resistance can be soldered according to the reflow-soldering method in a specifically designed heating zone involving plural preheating chambers and a reflowing chamber while maintaining a difference in temperature between the obverse surface and the reverse surface of the board without causing any soldering failure and any environmental pollution.

REFERENCES:
patent: 4554437 (1985-11-01), Wagner et al.
patent: 4761881 (1988-08-01), Bora et al.
patent: 4771929 (1988-09-01), Bahr et al.
patent: 4938410 (1990-07-01), Kondo

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