Method and apparatus for reducing warpage of an assembly substra

Details Method and apparatus for reducing warpage of an assembly substra Method and apparatus for reducing warpage of an assembly substra

Filed on

1996-03-29

Date issued

1998-05-12

Examiner

Picard, Leo P.

Patent Class

Electricity: electrical systems and devices

SubClass

Housing or mounting assemblies with diverse electrical...

SubSubClass

For electronic systems and devices

Other Related Categories

361758, 361756, 361760, 361770, 361807, 361809, 361765, 2281231, 257684, 257686, 257780, 174 524, 174 521, 174250, 174255, 437203, 437209, 437180, H05K 118

Type

Patent

Status

active

Patent number

057515565

Description

ABSTRACT:
A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.

REFERENCES:
patent: 4390220 (1983-06-01), Benasutti
patent: 4504887 (1985-03-01), Bakermans et al.
patent: 5413489 (1995-05-01), Switky
patent: 5515241 (1996-05-01), Werther

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