Method and apparatus for reducing warpage of an assembly substra

Details Method and apparatus for reducing warpage of an assembly substra Method and apparatus for reducing warpage of an assembly substra

1996-03-29

1998-05-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361758, 361756, 361760, 361770, 361807, 361809, 361765, 2281231, 257684, 257686, 257780, 174 524, 174 521, 174250, 174255, 437203, 437209, 437180, H05K 118

Patent

active

057515565

ABSTRACT:
A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.

REFERENCES:
patent: 4390220 (1983-06-01), Benasutti
patent: 4504887 (1985-03-01), Bakermans et al.
patent: 5413489 (1995-05-01), Switky
patent: 5515241 (1996-05-01), Werther

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