Dynamic magnetic information storage or retrieval – Head mounting – Disk record
Reexamination Certificate
2005-01-13
2008-10-07
Chen, Tianjie (Department: 2627)
Dynamic magnetic information storage or retrieval
Head mounting
Disk record
Reexamination Certificate
active
07433157
ABSTRACT:
An apparatus and method for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities. The method provides a base-metal layer for the ELS. A dielectric layer above the base-metal layer is also provided. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein both a size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced such that the solder pad to a ground, and solder on the solder pad to adjacent solder on adjacent pads, capacitance are reduced providing low signal reflection losses and a decrease in cross-talk.
REFERENCES:
patent: 5098311 (1992-03-01), Roath et al.
patent: 5422764 (1995-06-01), McIlvanie
patent: 5815919 (1998-10-01), Nakanishi et al.
patent: 5909342 (1999-06-01), Forbord et al.
patent: 5995329 (1999-11-01), Shiraishi et al.
patent: 6414820 (2002-07-01), Coon et al.
patent: 6420659 (2002-07-01), Tsutsumi et al.
patent: 6529350 (2003-03-01), Itoh
patent: 6543673 (2003-04-01), Lennard et al.
patent: 6573711 (2003-06-01), Schaenzer et al.
patent: 6700748 (2004-03-01), Cowles et al.
patent: 6891700 (2005-05-01), Shiraishi et al.
patent: 6942817 (2005-09-01), Yagi et al.
patent: 6963471 (2005-11-01), Arai et al.
patent: 7079357 (2006-07-01), Kulangara et al.
patent: 7124496 (2006-10-01), Kashima et al.
patent: 2002/0105760 (2002-08-01), Someya
patent: 2002/0181156 (2002-12-01), Shiraishi et al.
patent: 2002/0181157 (2002-12-01), Serizawa et al.
patent: 2003/0053257 (2003-03-01), Wada et al.
patent: 2003/0193753 (2003-10-01), Arai et al.
patent: 2004/0027631 (2004-02-01), Nagano et al.
patent: 2004/0134684 (2004-07-01), Rissing et al.
patent: 2005/0042852 (2005-02-01), Chou et al.
patent: 2005/0078415 (2005-04-01), Tsuchiya et al.
patent: WO 98/14937 (1998-04-01), None
Arya Satya Prakash
Xing Xinzhi
Chen Tianjie
Hitachi Global Storage Technologies - Netherlands B.V.
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