Method and apparatus for reducing package height for microcircui

Details Method and apparatus for reducing package height for microcircui Method and apparatus for reducing package height for microcircui

1983-12-02

1985-10-15

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 52S, 29588, H05K 504, H01L 3902

Patent

active

045476241

ABSTRACT:
An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.

REFERENCES:
patent: 4008945 (1977-02-01), Scherer
patent: 4262300 (1981-04-01), Scherer
patent: 4266089 (1981-05-01), Scherer
patent: 4266090 (1981-05-01), Scherer
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4412093 (1983-10-01), Wildeboer
patent: 4451540 (1984-05-01), Baird et al.
patent: 4453033 (1984-06-01), Duff et al.

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