Method and apparatus for reducing die stress

Details Method and apparatus for reducing die stress Method and apparatus for reducing die stress

1988-04-26

1990-08-28

Hille, Rolf

357 70, H01L 2312, H01L 2314, H01L 2354

Patent

active

049529994

ABSTRACT:
A slotted metallic die attach pad is disclosed for attachment of a semiconductor die, such as a silicon die, to form a die assembly demonstrating significantly reduced die attach stress. A plurality of substantially parallel, unidirectional slots in the die attach pad permits deformation of the die attach pad at the slots to compensate for differences in the thermal expansion coefficients of the silicon die and the metallic die attach pad. Stress sensitive components of the die are aligned in a stress sensitive direction, and the die is bonded on the die attach pad so that the stress sensitive direction is generally orthogonal to the longitudinal axes of the slots. A method for relieving die stress in a die assembly is also disclosed.

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