Fluid handling – Processes – With control of flow by a condition or characteristic of a...
Reexamination Certificate
2007-04-02
2010-06-29
Hepperle, Stephen (Department: 3753)
Fluid handling
Processes
With control of flow by a condition or characteristic of a...
C137S119100, C210S739000, C438S747000
Reexamination Certificate
active
07743783
ABSTRACT:
A method and apparatus for recycling a process fluid from a drain of a semiconductor process tool. The process fluid may be an acidic cobalt solution or an electroless cobalt solution used in a semiconductor process step to prevent electromigration in copper interconnects. The used process fluid is collected from the tool drain and recycled back to the tool inlet if a condition of the fluid is within a predetermined range. Otherwise, the used process fluid is drained from the system. The system may also operate in a bleed and feed mode where a portion of the used process fluid is periodically drained from the system.
REFERENCES:
patent: 5370269 (1994-12-01), Bernosky et al.
patent: 5490611 (1996-02-01), Bernosky et al.
patent: 5522660 (1996-06-01), O'Dougherty et al.
patent: 5632866 (1997-05-01), Grant
patent: 5632960 (1997-05-01), Ferri, Jr. et al.
patent: 5803599 (1998-09-01), Ferri, Jr. et al.
patent: 5855792 (1999-01-01), Adams et al.
patent: 5924794 (1999-07-01), O'Dougherty et al.
patent: 6026837 (2000-02-01), Chen
patent: 6098843 (2000-08-01), Soberanis et al.
patent: 6126531 (2000-10-01), Iida et al.
patent: 6269975 (2001-08-01), Soberanis et al.
patent: 6340098 (2002-01-01), Soberanis et al.
patent: 6482325 (2002-11-01), Corlett et al.
patent: 6622745 (2003-09-01), Smith et al.
patent: 6675987 (2004-01-01), Soberanis et al.
patent: 6796703 (2004-09-01), Lemke
patent: 2004/0185683 (2004-09-01), Nakamura
patent: 2005/0001324 (2005-01-01), Dunn et al.
patent: 2005/0110149 (2005-05-01), Osaka et al.
patent: 2005/0263488 (2005-12-01), Change et al.
Peter Singer; “The Advantages of Capping Copper With Cobalt,” Semiconductor International, Oct. 1, 2005.
http://www.reed-electronics.com/semiconductor/index.asp? layout=articlePrint&articleID=. . . ; pp. 1-5.
Neil V. Gayle, Dave Anderson; “Materials Supply Chain Management Efforts at ISMT,” Semiconductor International, Mar. 1, 2003.
http://www.reed-electronics.com/semiconductor/index.asp? layout=articlePrint&articleID=. . . pp. 1-10.
Air Liquide Electronics U.S. LP
Hepperle Stephen
McQueeney Patricia E.
LandOfFree
Method and apparatus for recycling process fluids does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for recycling process fluids, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for recycling process fluids will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4218714