Method and apparatus for reactive vapor deposition of metal comp

Details Method and apparatus for reactive vapor deposition of metal comp Method and apparatus for reactive vapor deposition of metal comp

1986-11-21

1988-10-11

Page, Thurman K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 38, 20419231, C23C 1600

Patent

active

047770627

ABSTRACT:
A method and apparatus are disclosed for the reactive vapor deposition of metal compounds onto a substrate. At least one metal is evaporated from an elongated evaporation crucible in an atmosphere consisting of a reaction gas at a pressure of no more than 10.sup.-1 mbar. The metal is evaporated by means of an electron beam having an acceleration voltage of at least 20 kv. The invention solves the problem of providing stable an repeatable operating conditions, even with an evaporation crucible of considerable length.

REFERENCES:
patent: 3371649 (1968-03-01), Gowen
patent: 3777704 (1973-11-01), Van Poucke
patent: 3974059 (1976-08-01), Murayama
patent: 4217855 (1980-08-01), Takagi
patent: 4286545 (1981-09-01), Takagi et al.
patent: 4561382 (1985-12-01), Zeren
patent: 4572842 (1986-02-01), Dietrick et al.

Affiliated with

Also associated with

Rating

Method and apparatus for reactive vapor deposition of metal comp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for reactive vapor deposition of metal comp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for reactive vapor deposition of metal comp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1957592