Method and apparatus for quantifying stress and damage in...

Details Method and apparatus for quantifying stress and damage in... Method and apparatus for quantifying stress and damage in...

2006-03-31

2009-12-15

Sniezek, Andrew L (Department: 2627)

Dynamic magnetic information storage or retrieval

Monitoring or testing the progress of recording

C360S025000

Reexamination Certificate

active

07633694

ABSTRACT:
The present invention provides a method and apparatus for quantifying stress and damage in magnetic heads. A change in a performance parameter of a magnetic recording head is characterized. The head is stressed by loading it onto and flying it over a rough zone of the recording medium. A post-stress read-back signal is read from the bit pattern written on the recording medium using the head subsequent to the stressing of the head. A performance parameter of the head is calculated using the post-stress read-back signal. The performance parameter of the head calculated using the post-stress read-back signal is compared to a performance parameter of the head calculated using a pre-stress read-back signal to characterize a change in performance of the head resulting from the stressing of the head.

REFERENCES:
patent: 6249392 (2001-06-01), Sacks et al.
patent: 6696832 (2004-02-01), Chew et al.
patent: 2002/0118473 (2002-08-01), Yong
patent: 2005/0024046 (2005-02-01), Duan et al.
patent: 2005/0073300 (2005-04-01), Matsukuma et al.
patent: 2005/0174703 (2005-08-01), Gill
patent: 2005/0190508 (2005-09-01), Gill
patent: 2006/0066299 (2006-03-01), Fox et al.

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