Method and apparatus for providing processor field upgradability

Details Method and apparatus for providing processor field upgradability Method and apparatus for providing processor field upgradability

1996-07-31

1997-07-01

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

29840, H01R 909

Patent

active

056430000

ABSTRACT:
Certain critical dimensions of an original microprocessor package, an upgrade socket, and an upgrade microprocessor package are made complementary to one another, enabling the upgrade socket to be wave soldered onto an area of the motherboard that encircles the area on which the original microprocessor package is surface mounted, and the upgrade microprocessor package remains capable of mating with the upgrade socket. In an alternate embodiment, in addition to having the various critical dimensions of the original microprocessor package, the upgrade socket and the upgrade microprocessor package coordinated with one another, the bottom portion of the upgrade socket is modified to have a smaller center out than the top portion of the upgrade socket, allowing a step to be exposed around the perimeter of the center cut out, and the original microprocessor package to be first solder mounted onto the new step, before the entire original microprocessor package and upgrade socket combination is wave soldered onto the motherboard.

REFERENCES:
patent: 4116519 (1978-09-01), Grabbe et al.
patent: 4356532 (1982-10-01), Donaher et al.
patent: 4632293 (1986-12-01), Feinstein
patent: 4696525 (1987-09-01), Coller et al.
patent: 4883428 (1989-11-01), Tonooka
patent: 5346402 (1994-09-01), Yasuho et al.

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