Method and apparatus for providing power to a microprocessor...

Details Method and apparatus for providing power to a microprocessor... Method and apparatus for providing power to a microprocessor...

2005-09-20

2005-09-20

Cuneo, Kamand (Department: 2827)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000

Reexamination Certificate

active

06947293

ABSTRACT:
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

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