Method and apparatus for providing PCB layout for probe card

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S761010, C324S762010

Reexamination Certificate

active

07154285

ABSTRACT:
An effective and easy to fabricate method to test multiple integrated circuit device designs using a single, probe card design is provided. A universal, probe card design is disclosed herein to test a plurality of integrated circuit devices at the wafer level. Integrated circuit probe pads and probe card probe I/O pins are designed in grid-like pattern on a region of the substrate. Ground terminal encircles the region of the I/O pins and power terminals are provided on the substrate. The I/O terminals can have a constant pitch array or a varying pitch array. The probe card can be used for a family of integrated circuit devices. A method to test flip chip, integrated circuits using a universal probe card has also been disclosed to reduce probe card proliferation and fabrication cost.

REFERENCES:
patent: 6479758 (2002-11-01), Arima et al.
patent: 6492832 (2002-12-01), Choi et al.
patent: 6639420 (2003-10-01), Chen et al.
patent: 6714828 (2004-03-01), Eldridge et al.
patent: 6727719 (2004-04-01), Liao et al.
patent: 6729019 (2004-05-01), Grube et al.
patent: 6967557 (2005-11-01), Hagios et al.
“COBRA Vertical Technology Probe Cards”, at http://www.wentworthlabs.com/product/cobra.htm on Apr. 23, 2004, pp. 1-3.

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