Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-04-11
2009-06-09
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S069000, C438S122000, C438S106000, C385S014000, C385S049000, C385S068000, C385S069000, C385S115000
Reexamination Certificate
active
07544527
ABSTRACT:
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.
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Benner Alan F.
Lin How Tzu
Pompeo Frank L.
Shinde Subhash L.
Cantor & Colburn LLP
International Business Machines - Corporation
Kusumakar Karen M
Nguyen Ha Tran T
Ortega Arthur
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