Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-01-31
1993-08-31
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257723, 257727, 257735, H01L 2348, H01L 2302, H01L 2316, H01L 2342
Patent
active
052412156
ABSTRACT:
An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly efficient thermal transfer and dissipating arrangement. The bracket is constructed and arranged to provide for placement of at least a first substrate for a hybrid circuit assembly thereon, and includes at least a first power transistor aperture (120, 122) with at least two bracket projections (146, 148) for permitting placement of said transistor on plural electrical contacts (104, 106). The heat generated by components on the circuit board(s) is transferred and dissipated substantially by biasing at least one bracket projection member resiliently against a heat sink (108, 110, 112, 114, 116, 118).
Lubbe John
Schmidt Detlef W.
Motorola Inc.
Prenty Mark V.
Stockley Darleen J.
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