Method and apparatus for providing emulator overlay memory suppo

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G06F 9455

Patent

active

058988580

ABSTRACT:
A method and apparatus for providing overlay memory support for ball grid array (BGA) microprocessor packages. A emulator having an overlay memory and an emulator probe is provided. The emulator is connected via the emulator probe to a target printed circuit board (e.g., adapter card). This target board includes a local processor, a local memory, a memory controller, and a local processor bus that couples them together. The local processor, local processor bus, and memory controller are integrated into a BGA chip package. Typically, the local processor executes software programs stored in the local memory. Upon receipt of a first signal, the memory controller disables the local memory and allows the emulator to drive data from the overlay memory onto the local processor bus so that the local processor may execute software programs included in the overlay memory.

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