Method and apparatus for providing an integrated circuit cover

Details Method and apparatus for providing an integrated circuit cover Method and apparatus for providing an integrated circuit cover

2005-03-22

2005-03-22

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S713000

Reexamination Certificate

active

06870246

ABSTRACT:
An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.

REFERENCES:
patent: 5783461 (1998-07-01), Hembree
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6229706 (2001-05-01), Cook et al.
patent: 6349032 (2002-02-01), Chan et al.
patent: 6472742 (2002-10-01), Bhatia et al.
patent: 6586684 (2003-07-01), Frutschy et al.
patent: 20020079571 (2002-06-01), Takeuchi et al.

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