Method and apparatus for providing a substrate with viscous...

Details Method and apparatus for providing a substrate with viscous... Method and apparatus for providing a substrate with viscous...

2011-04-26

2011-04-26

Meeks, Timothy H (Department: 1712)

Coating processes

Medical or dental purpose product; parts; subcombinations;...

Analysis, diagnosis, measuring, or testing product

C118S712000

Reexamination Certificate

active

07931933

ABSTRACT:
Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.

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Article by Robert Kirkpatrick—“Two-Dimensional, Closed-loop Inspection of Stencil Printing”—published in SMT/ Jul. 1999.

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