Woodworking – Process – Mechanical cutting or shaping
Patent
1995-10-23
1998-09-08
Bray, W. Donald
Woodworking
Process
Mechanical cutting or shaping
144174, 144230, 144241, 144172, 241294, B27C 100, B27L 1100
Patent
active
058031430
ABSTRACT:
Wood wafers are produced by feeding logs to a rotary cutter head drum with the longitudinal axis of the logs disposed substantially parallel to the rotational axis of the drum. The drum mounts a plurality of wafer cutting head units arranged in a V-shaped pattern with the apex of the V trailing the base thereof and with the cutting blades defining the ends of the base positioned at the opposite ends of the operative length of the drum. Each wafer cutting blade having a cutting edge disposed substantially parallel to the axis of the drum and offset circumferentially and axially from an adjacent cutting blade so that the cut produced by a cutting blade overlaps the cut produced by the next adjacent preceding cutting blade.
REFERENCES:
patent: 2969816 (1961-01-01), Johnsa
patent: 2997082 (1961-08-01), Schubert et al.
patent: 3017912 (1962-01-01), Sybertz et al.
patent: 3025895 (1962-03-01), Girard
patent: 3209801 (1965-10-01), Little et al.
patent: 3219076 (1965-11-01), Logan et al.
patent: 3314459 (1967-04-01), Beaubien
patent: 3783916 (1974-01-01), Nicholson et al.
patent: 3814154 (1974-06-01), Nicholson
patent: 3866645 (1975-02-01), Sybertz
patent: 3989076 (1976-11-01), Zurcher
patent: 4077450 (1978-03-01), Ackerman
patent: 4109690 (1978-08-01), Berg
patent: 4785860 (1988-11-01), Arasmith
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