Method and apparatus for producing ultra-thin semiconductor...

Details Method and apparatus for producing ultra-thin semiconductor... Method and apparatus for producing ultra-thin semiconductor...

2007-10-02

2007-10-02

Smith, Bradley K (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S457000, C438S458000, C257SE21599

Reexamination Certificate

active

11196967

ABSTRACT:
A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor layer from a support substrate and thereby improve the productivity and quality. The method uses two porous peeling layers on opposite sides of a substrate to produce an ultra-thin substrate.

REFERENCES:
patent: 5453394 (1995-09-01), Yonehara et al.
patent: 6194245 (2001-02-01), Tayanaka
patent: 6682990 (2004-01-01), Iwane et al.
patent: 2003/0203547 (2003-10-01), Sakaguchi et al.
patent: 2005/0074954 (2005-04-01), Yamanaka

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