Method and apparatus for producing engineered wood flakes, wafer

Details Method and apparatus for producing engineered wood flakes, wafer Method and apparatus for producing engineered wood flakes, wafer

1985-04-29

1987-07-21

Bray, W. D.

Woodworking

Process

Mechanical cutting or shaping

144162R, 144176, 144 3R, 144380, 241296, 430945, B27L 502, B27L 700

Patent

active

046811460

ABSTRACT:
Square or rectangular clean cut flakes, wafers or strands of a uniform thickness, width and length, with edges extending at right, acute or obtuse angles to the surfaces are produced by an apparatus in four distinct operations, comprising the veneer slicing, cutting of the veneer sheets into veneer strips, chemical or laser beam treatment and flake cutting. The chemical or laser beam treatment is applied to the edges of the veneer strips which run transversally to the direction of wood fiber and the application takes place before the veneer strips are cut into flakes. The treatment may be introduced for the purpose of sealing of the opened ends of wood fiber against water or water vapour absorption or to fortify and strengthen the flakes, wafers or strands against breakage along the wood fiber, to enhance the properties of the flakes, wafers or strands for the purpose of effective orientation in an electrostatic field or in other means of orientation in the production of agglomerated structural boards and lumber, to enhance the detectability of the position and degree of orientation of the flakes for the purpose of quality control, to color-code the flakes, wafers or strands for aesthetical, decorative or other reasons dictated by the manufacturing process or by the market. The moisture content and the mass of the flakes produced may be accurately monitored and the measurements processed in a computer and used for an effective control of the drying process.

REFERENCES:
patent: 2796094 (1957-06-01), Himmelheber et al.
patent: 3237663 (1966-03-01), Kirsten
patent: 3335771 (1967-08-01), Ledeizgerber
patent: 4176800 (1979-12-01), Brewer

Affiliated with

Also associated with

Rating

Method and apparatus for producing engineered wood flakes, wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for producing engineered wood flakes, wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for producing engineered wood flakes, wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-201780