Method and apparatus for producing conductive layers or structur

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437194, 437192, 437926, H01L 21283, H01L 21285

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054787807

ABSTRACT:
Methods and apparatus for producing conductive layers or structures for VLSI circuits. In a method for producing conductive layers or structures for VLSI circuits, at least two method stages are implemented in direct succession in different chambers of a high-vacuum system without interrupting the high-vacuum conditions for the semiconductor substrate. Avoiding exposure to air between the method stages produces noticeably improved layer properties and enables particularly simple and reliable multi-stage methods for producing conductive layers that promote a multi-layer wiring on the semiconductor substrate. An apparatus for implementing the method has a plurality of high-vacuum process chambers, at least one high-vacuum distributor chamber connecting the process chambers and of at least two high-vacuum supply chambers for semiconductor substrates.

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