Method and apparatus for processing workpieces with multiple pol

Details Method and apparatus for processing workpieces with multiple pol Method and apparatus for processing workpieces with multiple pol

1997-11-26

1999-11-02

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451287, B24B 100

Patent

active

059759917

ABSTRACT:
A chemical mechanical planarization (CMP) system includes multiple workpiece processing elements arranged in a vertically staggered configuration. The polishing elements are positioned such that an outer edge of a first polishing element overlaps the inner edge of a second polishing element. The overlapping arrangement enables the CMP system to utilize additional polishing elements without substantially increasing the footprint of the CMP system. Each of the polishing elements exhibit different polishing characteristics to enable multiple-step workpiece processing.

REFERENCES:
patent: 4481741 (1984-11-01), Bouladon et al.
patent: 5435772 (1995-07-01), Yu
patent: 5554065 (1996-09-01), Clover

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