Etching a substrate: processes – Nongaseous phase etching of substrate – Relative movement between the substrate and a confined pool...
Patent
1997-05-07
1999-03-09
Powell, William
Etching a substrate: processes
Nongaseous phase etching of substrate
Relative movement between the substrate and a confined pool...
156345, 216 92, B44C 122
Patent
active
058795766
ABSTRACT:
Method and apparatus for processing substrates through a number of wet treatments. A substrate is set on a substrate rotating means for rotation in a horizontal face-up position, within a housing which is open on its top side. By a treating liquid feed means having a treating liquid feed nozzle member, at least one kind of treating liquid is supplied onto upper surfaces of the substrate being rotated by the substrate rotating means. The treating liquid feed nozzle member is supported on a movable arm for displacement to and from an operative position vertically confronting the substrate and a receded standby position away from the substrate on the substrate rotating means. Located face to face with lower surfaces of the substrate is a nozzle means which supplies a fluid to the lower side of the substrate.
REFERENCES:
patent: 4350562 (1982-09-01), Bonu
patent: 4788994 (1988-12-01), Shinbara
patent: 4903717 (1990-02-01), Sumnitsch
patent: 5308447 (1994-05-01), Lewis et al.
Fukuda Hiroshi
Gonmori Kazuhiko
Ichikawa Hisayoshi
Morita Nobuo
Wada Kenya
Hitachi Electronics Engineering Co. Ltd.
Powell William
LandOfFree
Method and apparatus for processing substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for processing substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for processing substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1317379