Method and apparatus for processing samples

Details Method and apparatus for processing samples Method and apparatus for processing samples

1992-12-08

1999-02-09

Utech, Benjamin

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 12, 438704, 438718, 438738, B08B 600, H01L 21302

Patent

active

058688544

ABSTRACT:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.

REFERENCES:
patent: 4267013 (1981-05-01), Iida et al.
patent: 4308089 (1981-12-01), Iida et al.
patent: 4370195 (1983-01-01), Halon et al.
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4722355 (1988-02-01), Moe et al.
patent: 4855252 (1989-08-01), Peterman et al.
patent: 4974619 (1990-12-01), Yu
patent: 5007981 (1991-04-01), Kawasaki et al.
patent: 5134093 (1992-07-01), Onishi
patent: 5200017 (1993-04-01), Kawasaki et al.
patent: 5207868 (1993-05-01), Shinohara
patent: 5227001 (1993-07-01), Tamaki et al.
patent: 5246888 (1993-09-01), Miyamoto
patent: 5310624 (1994-05-01), Ehrlich
Elliott, Integrated Circuit Fabrication Technology, 1982, McGraw Hill Inc., pp. 57-59, 256, 257, 267 and 270-275.
Patent Abstracts of Japan, JP-A-55 072040, vol. 004, No. 117 (E-022), Aug. 20, 1980, Mitsubishi Electric Corp.
Database WPI, Derwent Publications Ltd., JP-A-63 157870, Jun. 30, 1988, Nichiden Anelba KK. (Abstract).
Database WPI, Derwent Publications Ltd., JP-A-63 204726, Aug. 24, 1988, Anelva Corp. (Abstract).
IBM Technical disclosure Bulletin, vol. 21, No. 10, (Mar. 1979), "Cleaning of Permalloy Mask After Exposure to Chlorine Rie System", Zarowin, p. 4237.
"Effect of Post-Etch Treatment on Chlorine Concentration of AlSi, and Ti Capped AlSi Films"; J. Voc. Sci.; B8(5); Sep. 1990; pp. 1052-1057; Maa et al.

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