Method and apparatus for processing electronic parts

Details Method and apparatus for processing electronic parts Method and apparatus for processing electronic parts

2007-02-13

2007-02-13

Paschall, Mark (Department: 3742)

Electric heating

Metal heating

By arc

C219S121400, C219S121590, C219S121480, C156S345430, C315S111210

Reexamination Certificate

active

10969274

ABSTRACT:
An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.

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patent: 2000-357865 (2000-12-01), None
patent: 2002-028597 (2002-01-01), None
Tomohiro Okumura, et al., “Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand.”, The Japan Institute of Metals, Materials Transactions, vol. 47, No. 3, (2006), pp. 1-7.

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