Method and apparatus for processing composite member

Details Method and apparatus for processing composite member Method and apparatus for processing composite member

2005-12-27

2005-12-27

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S406000, C438S455000, C438S977000, C156S064000, C156S230000, C156S241000, C156S378000, C156S380800, C156S580000

Reexamination Certificate

active

06979629

ABSTRACT:
A detection apparatus for detecting a feature portion of a composite member having a structure in which a first member having a separation layer inside is brought into tight contact with a second member. The composite member has, as the feature portion, a portion at which a peripheral edge of the first member projects outside a peripheral edge of the second member. The apparatus includes a shift detection section which detects a shift between the peripheral edge of the first member and the peripheral edge of the second member along an outer periphery of the composite member and a determination section which determines the feature portion on the basis of a detection result by the shift detection section.

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