Method and apparatus for processing a substrate with minimal...

Details Method and apparatus for processing a substrate with minimal... Method and apparatus for processing a substrate with minimal...

2005-09-13

2005-09-13

Ryan, Patrick Joseph (Department: 1745)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

C205S133000, C205S157000, C205S654000, C205S686000, C204S22400M, C204S22400M

Reexamination Certificate

active

06942780

ABSTRACT:
An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface region, a head configured to hold the wafer so that the surface of the wafer faces the cavity, and an electrical contact member positioned outside the cavity peripheral wall and configured to contact the second wafer surface region extending beyond the cavity, when the wafer is moved relative to the contact member. Advantages of the invention include substantially full surface treatment of the wafer.

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