Method and apparatus for processing a micro sample

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S492210, C250S492300

Reexamination Certificate

active

07470918

ABSTRACT:
An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.

REFERENCES:
patent: 4476386 (1984-10-01), Reid et al.
patent: 5093572 (1992-03-01), Hosono
patent: 5525806 (1996-06-01), Iwasaki et al.
patent: 5633502 (1997-05-01), Fischione
patent: 5270552 (1998-12-01), Ohnishi et al.
patent: 5852298 (1998-12-01), Hatakeyama et al.
patent: 5986264 (1999-11-01), Grunewald
patent: 6039000 (2000-03-01), Libby et al.
patent: 6300631 (2001-10-01), Shofner
patent: 6420722 (2002-07-01), Moore et al.
patent: 6538254 (2003-03-01), Tomimatsu et al.
patent: 6717156 (2004-04-01), Sugaya et al.
patent: 6781125 (2004-08-01), Tokuda et al.
patent: 6858851 (2005-02-01), Tomimatsu et al.
patent: 6927391 (2005-08-01), Tokuda et al.
patent: 6960765 (2005-11-01), Tomimatsu et al.
patent: 6982429 (2006-01-01), Robinson et al.
patent: 7115882 (2006-10-01), Moore
patent: 7126132 (2006-10-01), Moore
patent: 7126133 (2006-10-01), Moore
patent: 7138628 (2006-11-01), Tomimatsu et al.
patent: 7205554 (2007-04-01), Tokuda et al.
patent: 7205560 (2007-04-01), Tokuda et al.
patent: 2003/0183776 (2003-10-01), Tomimatsu et al.
patent: 2004/0089821 (2004-05-01), Shichi et al.
patent: 2004/0129897 (2004-07-01), Adachi et al.
patent: 2004/0246465 (2004-12-01), Iwasaki et al.
patent: 2005/0001164 (2005-01-01), Tokuda et al.
patent: 2007/0158560 (2007-07-01), Kaneoka et al.
patent: 2008/0029699 (2008-02-01), Kaneoka et al.
patent: 0 927 880 (1998-07-01), None
patent: 58-144755 (1983-09-01), None
patent: 09-326425 (1997-12-01), None
patent: 11-108813 (1999-04-01), None
patent: 10-013945 (1999-06-01), None
patent: 11-258130 (1999-09-01), None
patent: 11-260307 (1999-09-01), None
patent: 2000-146780 (2000-05-01), None
patent: 2000-251820 (2000-09-01), None
patent: WO099/05506 (1999-02-01), None
patent: WO99/17103 (1999-04-01), None
Ohnishi, T., et al.:A new focused-ion-beam microsampling technique for TEM observation of site-specific areas.ISTFA '99. Proceedings of the 25THInternational Symposium for Testing and Failure Analysis. ASM Int. 1999, pp. 449-453 (Nov. 14-18 1999). Materials Parks, OH, USA.
Pawley, James B.,:A Dual Needle Piezoelectric Micromanipulator for the Scanning Electron Microscope.The Review of Scientific Instruments, vol. 43, No. 4, Apr. 1972.
R. Weiland et al.:Wafer Conserving Full Range Construction Analysis for IC Fabrication and process Development Based on FIB/Dual Beam Inline Application,Proceedings from the 26thInternational Symposium for Testing and Failure Analysis, Nov. 12-16 2000, Bellevue, WA; pp. 393-396.
Japanese Office Action 2000-344226.
Partial European Search Report for European Patent Application No. 01121770.0-2208 dated May 5, 2007.
Muzino, F. et al., “Specimen Analysis Technique Using Electron and Ion Beams,” Hltachl Review, Hltachl Ltd., Tokyo, Japan, vol. 45, No. 1, Feb. 1, 1996, pp. 1-6, XP000593681.

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