Method and apparatus for process control with in-die metrology

Details Method and apparatus for process control with in-die metrology Method and apparatus for process control with in-die metrology

2007-03-12

2008-12-23

Shechtman, Sean P (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S030000, C700S121000, C700S174000, C700S175000, C438S017000, C356S630000

Reexamination Certificate

active

07469164

ABSTRACT:
Various embodiments include a method for providing instructions to a process tool. The method includes emitting an incident light beam at a substrate, receiving a reflected light beam from the substrate and determining a spectrum of the reflected light beam. The method further includes determining a first property of a first layer of the substrate and a second property of a second layer of the substrate, based on the spectrum determination. The method further includes comparing the first property of the first layer to a first reference property and comparing the second property of the second layer to a second reference property. The method further includes determining the instructions based on the first property comparison and the second property comparison; and providing the instructions to the process tool.

REFERENCES:
patent: 5867276 (1999-02-01), McNeil et al.
patent: 6242739 (2001-06-01), Cherkassky
patent: 6383824 (2002-05-01), Lensing
patent: 6413867 (2002-07-01), Sarfaty et al.
patent: 6479309 (2002-11-01), Wright
patent: 6483580 (2002-11-01), Xu et al.
patent: 6678055 (2004-01-01), Du-Nour et al.
patent: 6762838 (2004-07-01), Du-Nour
patent: 6801321 (2004-10-01), Du-Nour
patent: 6885467 (2005-04-01), Du-Nour et al.
patent: 6950196 (2005-09-01), Fielden et al.
patent: 7092096 (2006-08-01), Tao et al.
patent: 2003/0049390 (2003-03-01), Shanmugasundram et al.
Ying Wang, “Integrated dielectric trench-depth measurement for dual damascene”, Solid State Technology, vol. 42, No. 12, Dec. 1, 2004, 8 pgs total.

Affiliated with

Also associated with

Rating

Method and apparatus for process control with in-die metrology does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for process control with in-die metrology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for process control with in-die metrology will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4032291