Method and apparatus for probe tip contact

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S761010

Reexamination Certificate

active

10987353

ABSTRACT:
The invention is a method and apparatus for a probe tip contact for electrically coupling a substrate to a probe tip. The apparatus, in one embodiment, comprises a wrap-around contact that is precision formed utilizing a hydroform tool and brazed to a surface of a substrate. In another embodiment, the apparatus comprises a contact flange, a mounting flange extending from a first edge of the contact flange in an orientation substantially perpendicular to the contact flange, and a substantially circular indentation formed in the contact flange adapted for accommodating movement of said probe tip relative to said substrate.

REFERENCES:
patent: 5622519 (1997-04-01), Bixler et al.
patent: 5838519 (1998-11-01), Takizawa et al.
patent: 6404215 (2002-06-01), Nightingale et al.
patent: 6466000 (2002-10-01), Nightingale
patent: 6685514 (2004-02-01), Costa
patent: 6692265 (2004-02-01), Kung et al.
patent: 6888362 (2005-05-01), Eldridge et al.

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