Method and apparatus for probe tip cleaning and shaping pad

Details Method and apparatus for probe tip cleaning and shaping pad Method and apparatus for probe tip cleaning and shaping pad

2005-06-21

2005-06-21

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S533000

Reexamination Certificate

active

06908364

ABSTRACT:
A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.

REFERENCES:
patent: 3148404 (1964-09-01), Jensen
patent: 5652428 (1997-07-01), Nishioka et al.
patent: 5778485 (1998-07-01), Sano et al.
patent: 5814158 (1998-09-01), Hollander et al.
patent: 5961728 (1999-10-01), Kiser et al.
patent: 5968282 (1999-10-01), Yamasaka
patent: 5998986 (1999-12-01), Ido
patent: 6013169 (2000-01-01), Okubo et al.
patent: 6019663 (2000-02-01), Angell et al.
patent: 6056627 (2000-05-01), Mizuta
patent: 6130104 (2000-10-01), Yamasaka
patent: 6170116 (2001-01-01), Mizuta
patent: 6183677 (2001-02-01), Usui et al.
patent: 6280529 (2001-08-01), Meyer
patent: 6306187 (2001-10-01), Maeda et al.
patent: 6777966 (2004-08-01), Humphrey et al.
patent: 0 937 541 (1999-08-01), None
patent: 07244074 (1995-09-01), None
patent: 10019928 (1998-01-01), None

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