Method and apparatus for printing solder paste of different...

Details Method and apparatus for printing solder paste of different... Method and apparatus for printing solder paste of different...

2005-02-22

2005-02-22

Evanisko, Leslie J. (Department: 2854)

Printing

Stenciling

Processes

C101S127000, C101S123000, C427S096400

Reexamination Certificate

active

06857361

ABSTRACT:
A printing mask has protrusions having through holes defined therein for printing a solder paste on lands on a printed circuit board. The protrusions serve to increase the amount of solder paste filled in the through holes.

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Partial machine translation of JP 06-252152 from JPO website.*
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Korean Office Action, dated Jun. 28, 2004, together with Japanese language and English language translations.

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