Method and apparatus for printed circuit board pads with...

Details Method and apparatus for printed circuit board pads with... Method and apparatus for printed circuit board pads with...

2005-03-15

2005-03-15

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C174S261000, C361S767000, C029S843000, C439S083000

Reexamination Certificate

active

06867504

ABSTRACT:
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.

REFERENCES:
patent: 4091529 (1978-05-01), Zaleckas
patent: 4991666 (1991-02-01), Septfons et al.
patent: 5713126 (1998-02-01), Sakemi

Affiliated with

Also associated with

Rating

Method and apparatus for printed circuit board pads with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for printed circuit board pads with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for printed circuit board pads with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3387548