Method and apparatus for preventing cracks in semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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257727, H01L 2348, H01L 2352, H01L 2940

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active

056506660

ABSTRACT:
An anchor structure placed in an open field in corner areas of the semiconductor die and along die edges for preventing cracks in the die. In the corner areas, the anchor structure is placed perpendicular to a resultant vector force, which is approximately at a 45.degree. angle to an imaginary horizontal line passing through the die. This perpendicular placement of the anchor structure more uniformly distributes the stresses along the anchor preventing corner cracks in the die. Along the die edges, the anchor structures are placed approximately perpendicular to the resultant vector forces that impinge the die edges.

REFERENCES:
patent: 4926234 (1990-05-01), Katoh
patent: 5468996 (1995-11-01), Chan et al.
Integrated Circuit Engineering Corporation, Construction Analysis, "Altera EPM7256EQC160-20 EPLD", Scottsdale, AZ., Report No.: SCA9512-443, pp. 1-3, Fig. 7.
TI Technical Journal, May-Jun. 1988 Issue, pp. 96-108, article entitled, "Shear Stress Damage to Chips: A Design Solution", authored by Paul Nixon and Darvin Edwards.

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