Method and apparatus for pretreating a substrate prior to...

Details Method and apparatus for pretreating a substrate prior to... Method and apparatus for pretreating a substrate prior to...

2005-09-13

2005-09-13

Stinson, Frankie L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S148000, C134S153000, C134S184000, C134S902000

Reexamination Certificate

active

06941957

ABSTRACT:
A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

REFERENCES:
patent: 3461008 (1969-08-01), Laurie, Jr.
patent: 3880409 (1975-04-01), Bok et al.
patent: 3970471 (1976-07-01), Bankes et al.
patent: 4694527 (1987-09-01), Yoshizawa
patent: 4715392 (1987-12-01), Abe et al.
patent: 4739780 (1988-04-01), Czaja et al.
patent: 4850381 (1989-07-01), Moe et al.
patent: 5158616 (1992-10-01), Kinoshita et al.
patent: 5357645 (1994-10-01), Onodera
patent: 5357718 (1994-10-01), Kanno
patent: 5579792 (1996-12-01), Stanasolovich et al.
patent: 5697391 (1997-12-01), Segawa
patent: 5806544 (1998-09-01), Kosic
patent: 5873380 (1999-02-01), Kanno
patent: 5934566 (1999-08-01), Kanno et al.
patent: 6085764 (2000-07-01), Kobayashi et al.
patent: 6119706 (2000-09-01), Foederl et al.
patent: 6199567 (2001-03-01), Kanno et al.
patent: 6332470 (2001-12-01), Fishkin et al.
patent: 6517999 (2003-02-01), Oya et al.
patent: 2002/0162579 (2002-11-01), Wang et al.
patent: 4222272 (1993-02-01), None
patent: 56-58999 (1981-05-01), None
patent: 62-281430 (1987-12-01), None
patent: 63-296392 (1988-12-01), None
patent: 3-231427 (1991-10-01), None
patent: 3-255629 (1991-11-01), None
patent: 5-47738 (1993-02-01), None
patent: 5-129268 (1993-05-01), None
patent: 6-252120 (1994-09-01), None
patent: 10-41267 (1998-02-01), None

Affiliated with

Also associated with

Rating

Method and apparatus for pretreating a substrate prior to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for pretreating a substrate prior to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for pretreating a substrate prior to... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3389678