Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-03-01
2005-03-01
Fuqua, Shawntina (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S446100, C219S448140, C219S448170, C219S448120, C392S416000
Reexamination Certificate
active
06861619
ABSTRACT:
A wafer-cleaning module can remove contaminants from a semiconductor wafer prior to measurement in a metrology tool. A heating chamber and heater plate of the cleaning module can be used to heat the wafer by conduction, while a separate cooling chamber can be used to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
REFERENCES:
patent: 3887392 (1975-06-01), Tang
patent: 4032750 (1977-06-01), Hurko
patent: 5049816 (1991-09-01), Moslehi
patent: 5252807 (1993-10-01), Chizinsky
patent: 5261965 (1993-11-01), Moslehi
patent: 5306671 (1994-04-01), Ogawa et al.
patent: 5374594 (1994-12-01), van de Ven et al.
patent: 5439596 (1995-08-01), Ohmi et al.
patent: 5449411 (1995-09-01), Fukuda et al.
patent: 5589421 (1996-12-01), Miyashita et al.
patent: 5716207 (1998-02-01), Mishina et al.
patent: 5798837 (1998-08-01), Aspnes et al.
patent: 5897710 (1999-04-01), Sato et al.
patent: 5935768 (1999-08-01), Biche et al.
patent: 6056544 (2000-05-01), Cho
patent: 6261853 (2001-07-01), Howell et al.
patent: 6286230 (2001-09-01), White et al.
patent: 0 462 459 (1991-06-01), None
patent: 4-357836 (1991-06-01), None
patent: 04357823 (1992-12-01), None
patent: 10-137704 (1996-11-01), None
patent: WO 9500681 (1995-01-01), None
patent: WO 9805066 (1998-02-01), None
patent: WO 9902970 (1999-01-01), None
patent: WO 99356677 (1999-07-01), None
K. Imen, S.J. Lee & S.D. Allen, “Laser-assisted micron scale particle removal,”Appl. Phys. Lett., vol. 58, No. 2, Jan. 14, 1991, pp. 203-205.
Bowman Barry Roy
Howell Michial Duff
Fuqua Shawntina
Stallman & Pollock LLP
Therma-Wave, Inc.
LandOfFree
Method and apparatus for preparing semiconductor wafers for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for preparing semiconductor wafers for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for preparing semiconductor wafers for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3391947