Method and apparatus for preparing a plurality of dice in...

Details Method and apparatus for preparing a plurality of dice in... Method and apparatus for preparing a plurality of dice in...

2005-04-19

2005-04-19

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000

Reexamination Certificate

active

06881610

ABSTRACT:
An apparatus and method for preparing a plurality of dice on a semiconductor wafer. In one embodiment, a method according to embodiments of the present invention includes arranging a plurality of dice in a semiconductor wafer such that there is a separation region between each neighboring die of the semiconductor wafer. One or more trenches are etched in the separation region of the semiconductor wafer to form one or more lateral surfaces of one or more of the plurality of dice. The semiconductor wafer is then fractured into separate pieces at the one or more trenches to separate the plurality of dice from each other.

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patent: 6642127 (2003-11-01), Kumar et al.
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patent: 05277793 (7-106285) (1995-04-01), None
Stanley Wolf Silicon Processing for the VSLI Era vol. 2 Lattice Press 1986 p. 55.

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