Method and apparatus for preparing a bonding wire

Details Method and apparatus for preparing a bonding wire Method and apparatus for preparing a bonding wire

1989-05-18

1990-03-20

Godici, Nicholas P.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, 228179, 228 45, 242147A, 226 24, 226 45, 226 95, B23K 2026, H01L 2160

Patent

active

049094319

ABSTRACT:
A method and an apparatus for preparing a bonding wire, such as gold wire, drawn in contact-free manner from a bonding wire spool mounted in rotary manner about its longitudinal axis and supplied to a bonding device for forming circuits on electronic components. The apparatus constructed as a subassembly essentially comprises an electromotively-driven bonding wire spool carrier arranged on a support plate and a removal station provided with an optronic sensor. The bonding wire is deflected by means of air flows (P' or Q') for forming a bonding wire reserve in the removal station and the wire position is scanned by the optronic sensor. In the case of a decreasing bonding wire reserve, a signal is produced as a function of the bonding wire position, which is processed in a signal evaluation unit and is transmitted to a control unit, by means of which an electromotive drive operatively connected with the spool carrier is operated.

REFERENCES:
patent: 4763826 (1988-08-01), Kulicke, Jr. et al.

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