Method and apparatus for preheating semiconductor chips

Details Method and apparatus for preheating semiconductor chips Method and apparatus for preheating semiconductor chips

1990-01-18

1991-04-23

Bennet, Henry A.

Heating

Work chamber having heating means

Having means by which work is progressed or moved mechanically

432 5, 432 6, 432 11, 432122, 432239, 432 33, F27D 300, F27D 1300

Patent

active

050095900

ABSTRACT:
A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.

REFERENCES:
patent: 4102481 (1978-07-01), Ollenbach
patent: 4531909 (1985-07-01), Takeshita
patent: 4778382 (1988-10-01), Sakashita

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