Method and apparatus for prediction of polishing condition,...

Details Method and apparatus for prediction of polishing condition,... Method and apparatus for prediction of polishing condition,...

2007-10-30

2007-10-30

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C438S692000

Reexamination Certificate

active

11706212

ABSTRACT:
A polishing-condition predicting apparatus determines optimum parameters to be substituted into various function models by performing calibration by use of a TEG. A polishing condition enabling polishing of a thin film formed on a substrate to be designed so as to obtain a desirable height of the thin film and a desirable depth of a groove is predicted by simulation using the determined optimum parameters.

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patent: 2004-516680 (2004-06-01), None

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