Thermal measuring and testing – Temperature measurement – Combined with diverse art device
Reexamination Certificate
2007-07-26
2011-11-01
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Temperature measurement
Combined with diverse art device
C374S102000, C374S029000, C374S001000, C374S005000, C702S130000, C702S099000, C703S002000
Reexamination Certificate
active
08047712
ABSTRACT:
The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.
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“Cooling Techniques for Electronic Equipment”, Chapter 9, pp. 331-341, 2nd Edition, by Dave S. Steinberg, Copyright 1991 by John Wiley and Sone, Inc.
Shih Ming T.
Sturner William P.
Howard IP Law Group PC
Lockheed Martin Corporation
Verbitsky Gail
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